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News
FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration
7+ hour, 49+ min ago (271+ words) Warpage and alignment error scale with panel area. They are introduced during cure and anneal. Oven performance therefore bears directly on panel level packaging yield. Chamber Sized to One Panel Format Sub-50ppm Oxygen for PI BCB and PBO Cure The…...